Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Artificial intelligence has been bottlenecked less by raw compute than by how quickly models can move data in and out of memory. A new generation of memory-centric designs is starting to change that, ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Embedded Dynamic Random Access Memory (eDRAM) design is rapidly evolving to meet the escalating performance and energy efficiency demands of contemporary processors. This technology has emerged as a ...

Edge AI—enabling autonomous vehicles, medical sensors, and industrial monitors to learn from real-world data as it arrives—can now adopt learning models on the fly while keeping energy consumption and ...

MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

Chip startup d-Matrix Inc. today disclosed that it has raised $275 million in funding to support its commercialization efforts. The Series C round was led by Bullhound Capital, Triatomic Capital and ...