Universities need to have access to technology for teaching their students who can be trained at least on the most up to date technology processes. Research Laboratories usually need to have high ...
A technical paper titled “Process integration and future outlook of 2D transistors” was published by researchers at Intel Corporation. “The academic and industrial communities have proposed ...
A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers. This innovation transforms nanopore technology from a lab-scale concept ...
Silicon carbide devices are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting the last barriers ...
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