News: Trump's PERM suspension puts Indian green-card hopes under fresh pressure, raising questions about visa abuse, worker ...
Applied Materials and Besi expand strategic partnership to advance next-gen packaging for AI scaling
Expanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications ...
Large surge currents that can flow through power semiconductor modules in abnormal conditions must be countered by a ...
This collaboration builds on the two companies’ long history of working together to solve the complex semiconductor device ...
Mistral Large 4 challenges US and Chinese AI rivals with one trillion parameters, cybersecurity capabilities and open weights ...
The very critical role that semiconductors play in Europe’s future competitiveness, resilience and technological sovereignty was also highlighted ...
The company said the approach is designed to move customer engagement beyond predefined rules and faster execution towards AI ...
With reference hardware, software and design documentation, it reduces design risk, shorten development cycles, and ...
Pakal has developed and proven IGTO. IGTO delivers greater efficiency and reliability compared to existing power electronics ...
As enterprises move AI from pilots to production, AHEAD executives say data readiness, uncertain returns, power, cooling and ...
Infineon opens new backend manufacturing hub in Thailand adding resilient capacity for future growth
Designed for a phased expansion in the future, Bangkok has the potential to become one of Infineon's largest backend ...
At ElevenLabs Summit Bengaluru, voice AI moved beyond realistic speech into agents built for scale, commerce, enterprise ...
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