RANsemi, a UK-based specialist in Open RAN baseband technology, and Radisys, a global provider of open telecom software, have ...
The company announced that its Xsens Sirius and Xsens Avior IMUs now feature real-time Heave functionality, providing sub-5 ...
The eight-month Phase A study will focus on developing the technical framework and commercial case for the proposed In-Orbit ...
LYNRED has launched Sirocco SW, a new extended shortwave infrared (eSWIR) detector designed to bring space‑grade ...
The enhanced agreement expands Anglia’s authorised sales territory to include Denmark, Finland, Norway and Sweden, as well as ...
Apple remained the world’s largest smartphone maker in 2025, securing a 20% share of global shipments, according to new ...
NXP Semiconductors has introduced UCODE X, a new RAIN RFID chip designed to deliver improved performance and greater ...
Morse Micro is making available the HaLowLink 2, the latest version of its long‑range Wi‑Fi HaLow networking platform.
Infineon Technologies and automotive technology firm HL Klemove have signed a memorandum of understanding to expand their ...
Microchip has released bespoke firmware for its MEC1723 embedded controller, supporting NVIDIA DGX Spark systems.
Anritsu Corporation and VTT Technical Research Centre of Finland have demonstrated a significant step forward in D‑band ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results