Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
Abstract: This letter proposes a new surrogate-based multiphysics optimization technique for microwave devices incorporating artificial neural networks (ANNs) and trust-region algorithm. In the ...
COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results