Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.

Artificial intelligence has been bottlenecked less by raw compute than by how quickly models can move data in and out of memory. A new generation of memory-centric designs is starting to change that, ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

Two executives from Samsung Electronics’ semiconductor business have been named IEEE fellows for 2026, one of the highest ...

Researchers at the University of Pennsylvania and University of Michigan have created the world's smallest fully programmable ...

Two executives at Samsung Electronics have been named as Institute of Electrical and Electronics Engineers (IEEE) Fellows by ...

Redmi A7 Pro and Poco C81 appear on FCC and GSMA databases, revealing a big display, Unisoc chipset, 6000mAh battery, and Android 15 plans.

A tiny chip makes medical wearables smarter with long battery life, low power, and accurate tracking to help keep patients safe and devices reliable.

Cupertino closes out one of its best years in recent memory, but not without its challenges. Apple is sending out one of its ...