Abstract: Gold wire bonding has been widely used as the first-level interconnect in semiconductor packaging. The increase in the gold price has motivated the industry search for an alternative to the ...

Welcome to my channel Mr Sagoo where you will learn how to make an idea with your own hands. Waiting for your support! We can't succeed without your love and support. Please don't forget to click like ...

Abstract: High-temperature thin-film strain gauges (HTFSGs) hold significant potential for monitoring extreme environments in fields such as aerospace, nuclear energy, and automotive engineering. With ...