Introduction: August 10, 2026, second upward revision of full-year forecastsOn August 10, 2026, MEC Company Ltd. (4971) upwardly revised its consolidated earnings forecast for the fiscal year ending ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

IntroductionWhen it comes to news about generative AI, eyes tend to be drawn to GPUs, AI servers, or data center investments ...

ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and ...

Intel has won a U.S. patent for embedding a microLED-equipped die in a glass substrate, with power delivered through TGVs and ...

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its ...

The Integrated portfolio now spans the following: metallization, bumping, dielectric and fine-line patterning for 2.5D, 3D ...

Qnity Electronics Q-- (NYSE: Q) supplies materials for stacked-chip packaging, a growing sector as AI accelerators shift from ...

BOE is sending 24-layer glass substrates for semiconductors to customers for verification in servers. A look at how its ...

Advanced Chip and Circuit Materials, Inc. (ACCM) today announced a major expansion of its US manufacturing capacity for the ...

Artificial intelligence (AI) infrastructure buildout is gaining momentum. Bank of America sees the U.S. semiconductor industry expanding at an 18% CAGR through 2030, a notable jump from its prior 14% ...

India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities.