Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Nvidia's ( NASDAQ: NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company ( NYSE: TSM) for at least the next year based on design ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

Chief executive of Advantest says major increase of B100/B200 complexity over H100/H200 dramatically increases testing times.

with the CoWoS-L product line increasing by 470% per annum as the main driving force. Taiwan’s equipment supply chain, including wet etching, dispensing, crystal picking, and other key process ...

The Blackwell chip faces production setbacks, including yield issues with TSMC's 4nm process, challenges with CoWoS-L packaging, and thermal design flaws. While some issues are being resolved ...