Semiconductor Engineering19h
Auto Ecosystem Begins Shift To Software-First Transition
Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...
Semiconductor Engineering1d
Recent Advances and Challenges in Processing-in-DRAM (ETH Zurich)
Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. Abstract “Memory-centric computing aims to ...
Semiconductor Engineering1d
2D Ferroelectric Field-Effect Transistors (Penn State, U. of Minnesota)
A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...
Semiconductor Engineering4d
Ammonia Plasma Surface Treatment for Improved Cu–Cu Bonding Reliability
A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...
Semiconductor Engineering4d
Co-Packaged Optics To Train/Run GenAI Models in Data Centers (IBM)
A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...
Semiconductor Engineering3d
Advancements in SOT-MRAM Device Development (imec)
A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec.
Semiconductor Engineering4d
Wafer Bin Map Defect Classification Using Semi-Supervised Learning
Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...
Semiconductor Engineering4d
In-Depth Study of Low-Power MCUs For Wearables (EPFL)
A new technical paper titled “Enabling Efficient Wearables: An Analysis of Low-Power Microcontrollers for Biomedical ...