Abstract: As the need for processing large amounts of data increases, power consumption and the complexity of semiconductor package patterns also rise, making thermal management crucial. Traditional ...
Abstract: We developed mass-production-friendly 100-Gb/s-PAM4-EMLs with a ridge waveguide structure, single butt-joint InGaAsP-MQW regrowth, and optimized AR coating, achieving 54 GHz bandwidth and ...
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