Utilize AI to analyze application runtime data (e.g., rendering time, communication latency), obtain optimization suggestions (such as reducing component re-rendering, reusing hardware connections), ...

Abstract: This paper introduces a novel staggered terminal layout for SiC MOSFET multi-chip power modules. The proposed layout reduces parasitic inductance by canceling inductance within the power ...

The next generation of orbital outposts is being designed to skip the painstaking, decade‑long construction that defined the ...

Abstract: In this article, an innovative layout is introduced to reduce the stray inductance of the multichip power modules (MCPMs) through reverse coupling of current in parallel power loops, which ...