Nickel plating on IC interconnect components serves as a protective layer that enhances the durability and performance of these components. It provides a smooth, dull grey appearance, although bright ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results