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Benchmark Reports 8.6% Decline in Q3 Revenue. TEMPE, AZ – Benchmark Electronic's third quarter revenue of $658 million represented a decline of 8.6% from the same quarter in 2023. Syrma Aims for $1B in Sales by FY27. CHENNAI, INDIA – Syrma SGS Technology is targeting $1 billion in revenue by 2027 and is evaluating manufacturing ...
Circuits Assembly Online Magazine - 01005: Size Does Matter
Feb 2, 2015 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies from 0.1mm (resistor) to 0.2mm (capacitor).
Defining Acceptable Voiding Levels Under QFNs - Circuits Assembly
Aug 20, 2019 · Two QFNs with different levels of voiding under the central termination. FIGURE 2 shows the void calculation made by the x-ray system on the two QFNs in Figure 1. The calculations indicate the QFN on the left has total voiding under the central pad of ~30%. The QFN on the right has just over 50% voiding under the central pad, thereby exceeding ...
Yes, J-STD-001 and IPC-A-610 Can Be Used Together - Circuits …
May 8, 2019 · Using the two documents together can be rewarding, but to do so successfully requires knowledge and vigilance. As an aside, IPC will host a pair of technical education courses, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, on Sept. 10 in Huntsville, AL, and on Dec. 3 in Anaheim, CA.
How APCT Came to Have 'A Solution for Anybody in North America'
Mar 31, 2023 · APCT in February completed the acquisition of Advanced Circuits Inc. (ACI), a printed circuit board fabricator based in Aurora, CO, and with facilities in Chandler, AZ, and Maple Grove, MN. The acquisition nearly doubles APCT's annual revenue to $200 million, and makes the company the third largest among PCB fabricators in …
Mitigation of Head-in-Pillow Defect - Circuits Assembly
May 19, 2017 · Head-in-pillow (HiP), also known as head-on-pillow (HoP) or ball in socket, is a solder joint defect that occurs mainly with BGA, CSP and package-on-package (PoP) components. During reflow, both the solder paste and solder ball melt. However, melted solder at the component ball and PCB pad do not join or coalesce after reflow.
Koh Young Debuts Zenith Alpha 3-D AOI - Circuits Assembly
Published: 03 October 2019. Zenith Alpha 3-D automated optical inspection (AOI) incorporates a “Smart and Dynamic” feature set, plus quality optimization technologies. Collects, analyzes and manages data in real-time to dynamically formulate a multifaced view of the assembly process. Provides reliable 3-D measurement and supports KSMART ...
Emerald EMS Acquires Saline Lectronic, Veris Manufacturing
Dec 1, 2020 · Both Saline, MI-based Saline Lectronics and Brea, CA-based Veris Manufacturing are manufacturers of high-mix, low- to medium-volume printed circuit board assemblies and box-builds for high-reliability end markets, including industrial controls, aerospace and defense, and medical. “All of us at Emerald are excited about the expanded geographic ...
Circuits Assembly Online Magazine - 2022 Magazine Archives
Thin foil printing for fine-feature boards. Next-generation engineers need next-generation training. Working in remote locations with unconventional hours strains communication. Supply chain pressures in 2022. Download PDF. OCTOBER ISSUE. View the Digital. Edition Here! Circuits Assembly Magazine online Magazine.
Virtex Acquires Circuit Technology - Circuits Assembly
Published: 04 March 2019. by Mike Buetow. MERRIMACK, NH -- Virtex Enterprises has acquired Circuit Technology, a contract manufacturer of high-mix, low-volume production of mission-critical products. Virtex, which is owned by Insight Equity Holdings, did not disclose financial or other terms. Merrimack, NH-based Cirtech was founded in 1984 and ...